The high thermal conductivity screed
PaRis 2.0 is the eco-sustainable, fiber-reinforced, high thermal conductivity, low thickness screed for underfloor heating/cooling systems, certified for CAMs.
The optimal choice for radiant floors
Thanks to its certified high thermal conductivity coefficient (λ = 2.02 W/mK), PaRis 2.0 is the most conductive screed for radiant floors, ideal for optimizing the performance of underfloor heating and cooling systems. This screed ensures a homogeneous and optimal heat transmission in the environments, promoting superior thermal comfort.
Fiber-reinforced and low shrinkage: maximum quality and safety
PaRis 2.0 is designed to be fiber-reinforced and low shrinkage, allowing the creation of surfaces up to 150 m² without joints and reinforcement meshes. This reduces work and improves the overall quality and safety of the flooring.
Suitable for all types of flooring and reduced installation times
Suitable for laying all types of flooring, PaRis 2.0 allows the application of moisture-sensitive surfaces (such as parquet, rubber, PVC, linoleum, and resilient materials) after just 4 days. For moisture-insensitive floorings (such as large format ceramics and similar), installation is possible starting from 3 days, with a minimum thickness of only 2 cm.
High compressive strength and ease of application
With a compressive strength of 250 kg/cm², PaRis 2.0 does not require the addition of thermofluidizing additives, simplifying the installation process. This screed can be pumped using traditional construction equipment, making the application easy and safe.
Sustainability and recycled materials for projects in line with CAM requirements
Made with 10% recycled material, PaRis 2.0 is the ideal solution for projects that follow CAM requirements, ensuring excellent performance and reduced environmental impact at the same time.
